Ultra-thin Double-sided FPC
Description
Connection Reliability
Design Guide
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A circuit board which reduces the bias force with a thin base Pl to combine improved flexibility with double-sided micro line processing.
Features
- Low repulsion due to thin base Pl
- Higher density with laser Via
- Finer pitch due to thin copper foil
Structure
Properties
Stiffness Properties
Connection Reliability
Connection Reliability (Oil Dip Test)
Design Guide
Type | Base material | Min.product total thickness | Min. TH diameter |
Min. Land diameter |
Min. L/S |
||
Cu thickness (including PTH) |
Pl thickness | Front side | Back side | ||||
Normal Double-sided FPC | 18 | 15~25 | 60.5 | 98.5 | 75 | 250 | 50/50 |
Ultra-thin Double-sided FPC | 12 | 15~25 | 54.5 | 86.5 | 50 | 200 | 40/40 |
[Remarks]
- *The above data are results of experiment at Nitto Denko and are not applicable as standard values.
Ultra-thin Double-sided FPC
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