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Sealing Compound ELEP COAT LSS Series

Name: Sealing Compound ELEP COAT LSS Series
Brand: Hong Teck Hin
Availability: OutOfStock

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Description

This moisture-preventing liquid sealant thoroughly protects circuit boards from changes in humidity, temperature, and other environmental factors. ELEP COAT LSS Series.

Features

It is and insulating / moistureproof coating material that protects the printed circuit board which is most important part of electronic equipment from harsh environments such as outdoor high temperature and high humidity.

Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.

Properties

Item	Unit	LSS-520MH	LSS-520MHB	LSS- 520MHF	LSS- 520MHB-K	LSS- 520MHF-K	LSS- 540E	Measurement Conditions
Appearance colour	-	Clear	Blue	Clear (Fluorescence by black light irradiation)	Blue	Clear (Fluorescence by black light irradiation)	Milky white
Base	%	25	25	25	15	15	40
Viscosity	mPa ·s	400	400	400	40	40	12	25℃
Young's modulus	MPa	75	75	75	75	75	9.2	Tensile speed 10mm/min
Elongation (23℃)	%	460	460	460	460	460	500	Tensile speed 300mm/min
Moisture vapor permeability	g/cm²-day	0.002	0.002	0.002	0.002	0.002	0.0035	40℃ * 90%RH
Moisture vapor permeability	g/cm²-day	0.002	0.002	0.002	0.002	0.002	0.0035	Coating thickness:100µm
Specific volume resistance	Ω·cm	3.3 * 10^16	3.3 * 10^16	3.3 * 10^16	3.3 * 10^16	3.3 * 10^16	2.4 * 10^16	JIS C2103
Dry to touch	min.	5	5	5	5	5	15	Coating thickness:20µm

[Extra Info]

* Measurements provided here are measurement value examples and are not guaranteed.

Applications

ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.