Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series

This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .

HR9000

Full-auto Tape Remover for 200mmTAIKO wafer

Operation flow

Features

• TAIKO wafer available
• Non-contact transferring by Bernoulli method
• Contamination-less transferring (by using Twin arm Robot)
• Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
  (Peeling trigger & Edge keeper: Option)
• Low stress peeling by partly peeling tape applying
• Easy operation by Touch panel & Recipe function
• Follow to CE mark / SEMI S2/S8
• Adding SECS/GEM available

Basic spesifications

• Applicable wafer size：　8 inch／6 inch
• Applicable wafer thickness：　TAIKOwafer：50um or more,
  Normal wafer: 150um or more
• Throughput：　TAIKOwafer：30wafers/hr.
  Normal wafer： 50wafers/hr

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.