Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.

DV3000

Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)

Operation flow

Features

• FOUP/Open cassette available
• Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
• Easy operation by Touch panel & Recipe function
• Log file function standard equipment
• Follow to CE mark / SEMI S2/S8
• Adding Wafer mapping scanner available
• Adding SECS/GEM available

Basic spesifications

• Applicable frame size：　300mm
• Applicable wafer size：　300mm
• Applicable wafer thickness：　775um
• Throughput：　45wafers/hr.