Protection Tape Applicator for Backgrinding Process NEL SYSTEM™ Series
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
DR3000III
Full-auto Protection Tape Applicator for 300mm wafer
Operation flow
Features
- FOUP/Open cassette available
- Low tension applying / Applying stress control
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Tape sagging detection function
- Follow to CE mark & SEMI S2/S8
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
Basic specifications
- Applicable wafer size： 300mm／200mm
- Applicable wafer thickness： 400um or more
- Throughput： 68wafers/hr.
※Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
DR8500III
Full-auto Protection Tape Applicator for 200mm wafer
Operation flow
Features
- 8""/6""/5"" wafer available
4"" wafer handling function (Option) - Low tension applying (RF version)
- Adding Table/ Roller heating function available
- Easy operation by Touch panel
- Follow to CE mark
- Adding SECS/GEM available
Basic spesifications
- Applicable wafer size： 8/6/5/4 inch
- Applicable wafer thickness： Non back grinding wafer
- Throughput： 77wafers/hr. （RF version：68wafers／hr.）
※Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
DSA840II
Semi-auto Protection Tape Applicator for 200mm wafer
Operation flow
Features
- 8"/6"/5"/4" wafer available
- 8"- 4" wafer handling available by 1 table
- Easy operation by Touch panel
- Follow to CE mark / SEMI S2/S8
Basic spesifications
- Applicable wafer size： 8/6/5/4 inch
- Applicable wafer thickness： Non back grinding wafer
- Throughput： App.50sec.／wafer
※ Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
