Loctite E-60NC Epoxy Adhesive Cartridge Black 50ml
Description
potting compound with extended work life. Once mixed, the
two-part epoxy cures at room temperature to form a rigid, black
encapsulant that is non-corrosive to metallic components on PC
Boards and electronic assemblies. The fully cured epoxy
provides excellent environmental and chemical resistance, and
acts as an electrical insulator
Designed for bonding, potting and encapsulating electrical
components which are sensitive to corrosion. Used in
electronic applications, for component attachment to boards,
housing assembly and potting.
The graph below shows the shear strength developed over time
on abraded, acid etched aluminum lap shears with an average
bondline gap of 3 to 9 mils and tested according to ASTM D1002.
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Product shall be ideally stored in a cool, dry location in
unopened containers at a temperature between 8C to 28C
(46F to 82F) unless otherwise labeled. Optimal storage is at
the lower half of this temperature range. To prevent
contamination of unused product, do not return any material to
its original container. For further specific shelf life information,
contact your local Technical Service Center.
The data contained herein may be reported as a typical value
and/or range. Values are based on actual test data and are
verified on a periodic basis.
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Loctite E-60NC Epoxy Adhesive Cartridge Black 50ml
- Shear Strength, Steel : 2630 psi
- Storage Temperature : 46 - 82 °F
- Viscosity : 8000 mPa.s (cP) Brookfield
- Viscosity Part A (Resin) : 5200 - 7200 mPa.s (cP) Brookfield
- Viscosity Part B (Hardener) : 12000 - 14000 mPa.s (cP) Brookfield
- Key Substrates : Electrometric Material, Metal: Aluminum, Metal: Steel, Metal: Steel - Stainless Steel, Polyamide (Nylon), Polycarbonate, Wood
- Color : Black
- Curing Type : Room Temperature (Ambient) Cure
- Application : Bonding, Potting
- Extended work life
- Non-corrosive to metallic components on PC Boards and electronic assemblies
- Provides excellent environmental and chemical resistance and insulation
- Used in electronic applications, for component attachment to boards, housing assembly and potting
potting compound with extended work life. Once mixed, the
two-part epoxy cures at room temperature to form a rigid, black
encapsulant that is non-corrosive to metallic components on PC
Boards and electronic assemblies. The fully cured epoxy
provides excellent environmental and chemical resistance, and
acts as an electrical insulator
TYPICAL APPLICATIONS
Designed for bonding, potting and encapsulating electrical
components which are sensitive to corrosion. Used in
electronic applications, for component attachment to boards,
housing assembly and potting.
TYPICAL CURING PERFORMANCE
Cure Speed
The graph below shows the shear strength developed over time
on abraded, acid etched aluminum lap shears with an average
bondline gap of 3 to 9 mils and tested according to ASTM D1002.
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Directions For Use:
- For high strength structural bonds, removal of surface
contaminates such as paint, oxide films, oils, dust, mold
release agents and all other surface contaminates. - Use gloves to minimize skin contact. DO NOT use solvents
for cleaning hands. - Dual Cartridges: To use simply insert the cartridge into the
application gun and start the plunger into the cylinders using
light pressure on the trigger. Next, remove the cartridge cap
and expel a small amount of adhesive to be sure both sides
are flowing evenly and freely. If automatic mixing of resin
and hardener is desired, attach the mixing nozzle to the end of the cartridge and begin dispensing the adhesive. For
hand mixing, expel the desired amount of the adhesive and
mix thoroughly. Mix approximately 15 seconds after uniform
color is obtained. Bulk Containers: Mix thoroughly by
weight or volume in the proportions specified in Properties
of Uncured Material section. Mix vigorously approximately
15 seconds after uniform color is obtained. - For maximum bond strength apply adhesive evenly to both
surfaces to be joined. - Application to the substrates should be made within 60
minutes. Larger quantities and/or higher temperatures will
reduce this working time. - Join the adhesive coated surfaces and allow to cure at 25C
(77F) for 24 hours for high strength. Heat up to 93C
(200F), will speed curing. - Keep parts from moving during cure. Contact pressure is
necessary. Maximum shear strength is obtained with a 3-9
mil bond line. - Excess uncured adhesive can be cleaned up with ketone
type solvents.
Storage
Product shall be ideally stored in a cool, dry location in
unopened containers at a temperature between 8C to 28C
(46F to 82F) unless otherwise labeled. Optimal storage is at
the lower half of this temperature range. To prevent
contamination of unused product, do not return any material to
its original container. For further specific shelf life information,
contact your local Technical Service Center.
Data Ranges
The data contained herein may be reported as a typical value
and/or range. Values are based on actual test data and are
verified on a periodic basis.
Loctite E-60NC Epoxy Adhesive Cartridge Black 50ml
Sale price$36.00
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