Heat Resistance Back Grinding Tape

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).

Features

• Excellent TTV (Total Thickness Variation) performance.
• High heat resistance for the wafer backside process.
• Easy peeling off from ground wafers after several kinds of wafer backside processes.

Structure

Applications

• Wet etching or metalizing process of wafer backside of power devices, discrete devices, etc.
• Complicated process in backside of wafer, like IGBT etc.
• Other semiconductor processes which require a certain amount of heating.