Semiconductor Production Process Film NITOFLON™ Release Film for Molding Process MPS Series
描述
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MPS series are PTFE release film products for molding process with superior heat resistance and releasability.
Features
- Recommended operating temperature range is from -100℃ to 260℃ for continuous use, and can be used even in higher temperature for a short period.
- Adhesive substances would hardly attached to the film, and even if it attaches, it can be ealisiy removed.
- Product lineups are Standard type, Low thermal expansion type, and High-strength/high thermal contraction type.
Structure
Applications
- Mold release during semiconductor chip resin sealing
- Releasing from resin
- Protect mold from sticking excess sealing resin
- Reduce solvent
Properties
| Property | Unit | (Nitto)PTFE Film t0.05mm | |||
|---|---|---|---|---|---|
| MPS-10 | MPS-11 | MPS-13 | |||
| Tensile Strenght | MD | MPa | 50 | 58 | 79 |
| TD | 40 | 38 | 39 | ||
| Elongation | MD | ％ | 300 | 258 | 120 |
| TD | 340 | 351 | 335 | ||
| Coefficient of thermal Expansion | MD | 10-6/℃ | 0 | 33 | -527 |
| TD | 333 | 186 | 219 | ||
| Surface roughness | um | 0.27 | 0.20 | Gloss surface 0.24 Matte surface 0.36 |
|
| Melting Point | ℃ | 370 | |||
| Usable temperature (Continuous use) |
260 | ||||
| Feature | Standard | Low Thermal Expansion | ・High strength ・High thermal contraction |
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*This data represents examples of measured values, and not guaranteed values.
Experimental video
Heat Resistance
Sliding Properties
Electrical Insulation
Chemical Resistance
Mold Release Properties
Weather Resistance
