Sealing Compound ELEP COAT LSS Series
描述
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This moisture-preventing liquid sealant thoroughly protects circuit boards from changes in humidity, temperature, and other environmental factors. ELEP COAT LSS Series.
Features
It is and insulating / moistureproof coating material that protects the printed circuit board which is most important part of electronic equipment from harsh environments such as outdoor high temperature and high humidity.
- Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
- Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.
Properties
| Item | Unit | LSS-520MH | LSS-520MHB | LSS- 520MHF |
LSS- 520MHB-K |
LSS- 520MHF-K |
LSS- 540E |
Measurement Conditions |
| Appearance colour | - | Clear | Blue | Clear (Fluorescence by black light irradiation) | Blue | Clear (Fluorescence by black light irradiation) | Milky white | |
| Base | % | 25 | 25 | 25 | 15 | 15 | 40 | |
| Viscosity | mPa ·s | 400 | 400 | 400 | 40 | 40 | 12 | 25℃ |
| Young's modulus | MPa | 75 | 75 | 75 | 75 | 75 | 9.2 | Tensile speed 10mm/min |
| Elongation (23℃) | % | 460 | 460 | 460 | 460 | 460 | 500 | Tensile speed 300mm/min |
| Moisture vapor permeability | g/cm²-day | 0.002 | 0.002 | 0.002 | 0.002 | 0.002 | 0.0035 | 40℃ * 90%RH |
| Coating thickness:100µm | ||||||||
| Specific volume resistance | Ω·cm | 3.3 * 10^16 | 3.3 * 10^16 | 3.3 * 10^16 | 3.3 * 10^16 | 3.3 * 10^16 | 2.4 * 10^16 | JIS C2103 |
| Dry to touch | min. | 5 | 5 | 5 | 5 | 5 | 15 | Coating thickness:20µm |
[Extra Info]
- * Measurements provided here are measurement value examples and are not guaranteed.
Applications
- ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
- When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
- In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.
Sealing Compound ELEP COAT LSS Series
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