Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series
描述
DV3000
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
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This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.
DV3000
Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)
Operation flow
Features
- FOUP/Open cassette available
- Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Follow to CE mark / SEMI S2/S8
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
Basic spesifications
- Applicable frame size： 300mm
- Applicable wafer size： 300mm
- Applicable wafer thickness： 775um
- Throughput： 45wafers/hr.
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
