LOCTITE® EDAG PF 455B E&C
Engineered for high-demand industrial electronics manufacturing, LOCTITE® EDAG PF 455B E&C (Part No. 1263298) is a premium commercial-grade, UV-curable dielectric ink designed for optimal performance on both treated and untreated polyester foil. This formulation delivers exceptional dielectric strength and moisture protection, making it ideal for high-reliability electronic assemblies requiring reduced silver migration risks.
- Screen-printable formulation optimized for precision production lines
- High breakdown voltage suitable for demanding crossover applications
- Superior humidity resistance for harsh operating environments
- Reliable adhesion on treated and untreated polyester substrates
Technical Specifications
- Product Name: LOCTITE® EDAG PF 455B E&C, 1.0 kg Container
- Part Number (SKU/IDH): 1263298
- Technology: UV-Curable Dielectric Ink
- Substrate Compatibility: Treated and Untreated Polyester Foil
- Key Characteristics: High breakdown voltage, excellent dielectric strength, and superior humidity resistance
Frequently Asked Questions
What substrates are compatible with LOCTITE EDAG PF 455B E&C?
This UV-curable dielectric ink is specifically formulated for strong adhesion on both treated and untreated polyester foil substrates used in printed electronics.
How does this dielectric ink prevent silver migration?
The high breakdown voltage and superior humidity resistance create a robust insulating barrier that significantly reduces the risk of silver migration across circuit crossovers.
Is bulk pricing and wholesale purchasing available for this product?
Yes, wholesale quantities and bulk purchasing options are in stock for commercial buyers and procurement managers. Contact our team directly for lead times and tiered pricing.
Request Wholesale & Bulk Pricing
Ensure your production line stays fully stocked with verified commercial-grade materials. We offer secure logistics and dedicated support for bulk purchasers. To place an order or request commercial terms, please Contact Us.
