Ultrahigh-molecular-weight Polyethylene Porous Film SUNMAP™

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Porous film offers air permeability without changing the characteristics of ultrahigh-molecular-weight polyethylene.

"SUNMAP™" is an ultrahigh-molecular-weight polyethylene porous film developed by Nitto Denko's original technology of special calcinations in which ultrahigh-molecular-weight polyethylene powder is formed into a porous sintered compact, then cut. The porous film provides new characteristics such as air permeability and low friction coefficient while maintaining the superior characteristics of ultrahigh-molecular-weight polyethylene such as chemical resistance, abrasion resistance, and releasability. With excellent processability, it offers and will expand a wide range of applications.


  • Porous film of open cell with excellent air permeability and moisture permeability.
  • Offers superior sliding property by making ultrahigh-molecular-weight polyethylene porous which has excellent abrasion resistance and low friction coefficient.
  • Hardly affected by virtually all the chemicals including acid and alkali with its chemical stability.
  • Can be used for heat sealing, punching and for fillers with its excellent processability.


Product No. SUNMAP LC-T
Thickness [mm] 0.5
Average pore size [µm] 17
Air permeability [sec/100cm3] 1.4
Porosity [%] 30
Tensile strength [Mpa] 12
Elongation [%] 90
Hardness [Shore D] 48
Surface roughness(Ra) [µm] 2.0
Dynamic coefficient of friction 0.1


  • * The above values are sample observed values, not the guaranteed performance.


  • Absorption/fixing of ceramic green sheet.
  • Fixing when cutting LCD panel, cutting glass/ceramic substrates
  • Fixing during FPC board screen printing
  • Fixing during semiconductor wafer dicing
  • For polishing and fixing lenses
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