Thin-film Metal Base Board CISFLEX™

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Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.


  • High density
  • High dimensional precision
  • Metal base


Connection Methods

Solder Bump

  • A coreless bump is formed with solder paste.
  • Can be thermally bound.

Flying Lead

The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.

Process Accuracy

Gold-ball Bonding Pad

Flying Lead

Back Side Pad


*SUS is used as the base metal.
*Double-sided pads are available.
*The plating on the pad and the flying lead is either Ni-Au or Au.



  • Hard disk drive
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