Sintering Film FS-A101 For Bonding of Semiconductors (Silver Sintering, Sintering Bonding)
FS-A101 is a sintering bonding film in which sinterable silver particles are dispersed at high concentration in an organic matrix. Before the film is sintered, it is excellent in stability at room temperature and flexible with good thickness control as well as easy to handle and has workability with good material yield ratio. Also, it has tackiness by the design of organic matrix and can be pre-bonded without extra adhesive. When the film is sintered, the layer can be uniform and smooth without preheating, which is applied to avoid bleeding. The sintered layer has heat and electrical conductivity specific to Ag, and has a robust reliability with excellent thermal resistance and mechanical property.
Features
- Thickness-controlled flexible film that can be stored at room temperature
- Easy to handle and has good workability with good material yield ratio
- Tackiness helps to prebond without additional treatment
- Sintering without bleed or unevenness can be achieved without preheating.
- After sintering, it has heat and electrical conductivity specific to Ag.
- Robust reliability with excellent thermal resistance and mechanical property.
Structure
Standard thickness of precursor layer before sintering is 50μm but it can be designed arbitrarily.