LOCTITE® ECCOBOND NCP 5209

LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.