LOCTITE® ECCOBOND E 3230

LOCTITE® ECCOBOND E 3230

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Description
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant
LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
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