High Density and Precision Flexible Printed Circuit

Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.

Features

Subtractive

• High resolution etching technology enables high aspect ratio line processing.

Semi-additive

• Because the conductor shape is not trapezoidal, top width is maintained even at fine pitch.
  
• No need to make the conductor thin to gain top width.

Specs and Technical info

Subtractive process

Semi-additive process

Application

• For liquid crystal module applications.

[Remarks]

• *The figures are typical test results, and are not guaranteed values.
  
• *Application samples are only examples. Please evaluate the actual product thoroughly before usage.