
ELEP HOLDER_Dicing Tape V-8AR
Description
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V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time.
The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing.
Features
- Good adhesion stability in applied state (after taping).
- Excellent pick-up ability and good chipping performance.
- Tape has good expandability because of its PVC base film.
- Low organic contamination (by Electron Spectroscopy Chemical Analysis).
- Recommended chip size is 0.8mmsq – 5mmsq.
Application
- Nitto Semiconductor Wafer Tape, V-8AR is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).
Properties
Property | Unit | ELP V-8AR |
Thickness | [µm] | 75 |
Adhesion on mirror si-wafer | [N/20mm] | 1.2 |
Colour: Light Blue (Translucent)

ELEP HOLDER_Dicing Tape V-8AR
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