Double Sided Tape for Lead-free Soldering, Offering Excellent Heat-resistant and Repulsion Resistant Properties No.585
Description
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Ubstrate-included/heat-resistant double sided thin adhesive tape. Double sided adhesive tape with superior adhesion to applications with high repulsive force such as FPC bending.
Features
- Superior adhesiveness to applications with high repulsive force such as FPC bending.
- High shard removal processability/usage during die-cutting process.
- Can be soldered with the release liner attached. (heat resistant release liner)
- Double release liner type is also available. (Product: No.585W)
Structure
Properties
180° peeling strength [N/20mm] (to polyimide film) | 13 |
---|---|
Liner peeling strength [N/50mm] | 0.9 |
Liner peeling strength after reflow [N/50mm] | 1.3 |
[Remarks]
- Note) Reflow condition: peak temp 250℃
- * Measured by peeling in a 180° direction at a speed of 300 mm/min with 0.025 mm PET lining.
- * The figures are a sample of observed values, not guaranteed performance.
Applications
- Fixing FPC to chassis, fixing reinforcement plates of FPC.
- Other applications riring heat resistance.
Double Sided Tape for Lead-free Soldering, Offering Excellent Heat-resistant and Repulsion Resistant Properties No.585
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