Backgrinding Tape Line-up ELEP HOLDER™

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Description

Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.

Line-up

Caution

  • Please avoid skin contact, as this could cause rashes.
  • Please refer to a certified disposal company for safe disposal. (Do not incinerate as this may produce toxic gas or odors that can cause nausea if inhaled.)
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