Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic Devices HT Sheet
Description
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This thermal conduction sheet is effective for heating and cooling of integrated circuit devices, etc.
Features
- Provides excellent thermal conductivity using silicon gel as a matrix resin.
- Excellent fit and stress relaxation for irregular surfaces.
- A wide range of thicknesses are available to fit various gaps.
Properties
Lineup
Type | Color | Product No. | Thickness | Stickness |
Thermal resistance [m2K/W] |
Thermal conductivity [W/Mk]*1 |
Hardness*2 |
---|---|---|---|---|---|---|---|
Gel | Black | HT-050 | 0.5 | Single-coated | 0.50×10 -3 | 1.0 | 21 |
HT-080 | 0.8 | 0.82×10 -3 | |||||
HT-100 | 1.0 | 1.04×10 -3 |
[Extra Info]
- *1: ASTME-1530 method
- *2: Asker A-type hardness
* Measurements provided here are measurement value examples and are not guaranteed.
Applications
- Thermal measures for semiconductor modules, automotive ECU
Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic Devices HT Sheet
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