Devcon 5 Minute Epoxy Adhesive Gel 25ml #14250

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Description

Devcon 5 Minute Epoxy Adhesive Gel 25ml  #14250


Fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.
Features:
  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non sag which makes it ideal for use on vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage
  • Fast curing for bond tags on machinery and equipment
Surface Preparation:


  1. Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other contaminants.
  2. Surface can also be cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths.
  3. If working with metal, abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.

Mixing Instructions:


  1. Squeeze material into a small container the size of an ashtray.
  2. Using mixing stick included on Dev-tube handle, vigorously mix components for one (1) minute.
  3. Immediately apply to substrate.

50 ML/400ML/490 ML CARTRIDGES

  1. Attach cartridge to Mark V ™ [50ml] 400ml manual or pneumatic dispensing systems.
  2. Open tip.
  3. Burp cartridge by squeezing out some material until both sides are uniform (ensures no air bubbles are present during
    mixing).
  4. Attach mix nozzle to end of cartridge.
  5. Apply to substrate.

Application Instructions:


  1. Apply mixed epoxy directly to one surface in an even film or as a bead.
  2. Assemble with mating part within recommended working time.
  3. Apply firm pressure between mating parts to minimize any gap and ensure good contact (a small fillet of epoxy should
    flow out the edges to display adequate gap fill.)

For very large gaps:

  1. Apply epoxy to both surfaces
  2. Spread to cover entire area OR make a bead pattern to allow flow throughout the joint

Let bonded assemblies stand for recommended functional cure time prior to handling.
CAPABILITIES: Can withstand processing forces, Do not drop, shock load, or heavily load
Warranty:

ITW Performance Polymers will replace any material found to be defective. Because the storage, handling and
application of this material is beyond our control, we can accept no liability for the results obtained.
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