Ultrahigh-molecular-weight Polyethylene Porous Film SUNMAP™

Porous film offers air permeability without changing the characteristics of ultrahigh-molecular-weight polyethylene.

"SUNMAP™" is an ultrahigh-molecular-weight polyethylene porous film developed by Nitto Denko's original technology of special calcinations in which ultrahigh-molecular-weight polyethylene powder is formed into a porous sintered compact, then cut. The porous film provides new characteristics such as air permeability and low friction coefficient while maintaining the superior characteristics of ultrahigh-molecular-weight polyethylene such as chemical resistance, abrasion resistance, and releasability. With excellent processability, it offers and will expand a wide range of applications.

Features

• Porous film of open cell with excellent air permeability and moisture permeability.
• Offers superior sliding property by making ultrahigh-molecular-weight polyethylene porous which has excellent abrasion resistance and low friction coefficient.
• Hardly affected by virtually all the chemicals including acid and alkali with its chemical stability.
• Can be used for heat sealing, punching and for fillers with its excellent processability.

Properties

[Remarks]

• * The above values are sample observed values, not the guaranteed performance.

Applications

• Absorption/fixing of ceramic green sheet.
• Fixing when cutting LCD panel, cutting glass/ceramic substrates
• Fixing during FPC board screen printing
• Fixing during semiconductor wafer dicing
• For polishing and fixing lenses