Thin-film Metal Base Board CISFLEX™
Keterangan
Connection Methods
*SUS is used as the base metal.
*Double-sided pads are available.
*The plating on the pad and the flying lead is either Ni-Au or Au.
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Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.
Features
- High density
- High dimensional precision
- Metal base
Construct
Connection Methods
Solder Bump
- A coreless bump is formed with solder paste.
- Can be thermally bound.
Flying Lead
The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.
Process Accuracy
Gold-ball Bonding Pad
Flying Lead
Back Side Pad
[Remarks]
*SUS is used as the base metal.
*Double-sided pads are available.
*The plating on the pad and the flying lead is either Ni-Au or Au.
Applications
- Hard disk drive
Thin-film Metal Base Board CISFLEX™
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