{"product_id":"semiconductor-wafer-processing-tape-swt-10t-r","title":"Semiconductor Wafer Processing Tape SWT 10T+R","description":"\u003cp\u003eWafer processing tape designed for semiconductor dicing processes.\u003c\/p\u003e\n\u003cp\u003eNitto Semiconductor Wafer Tape SWT 10T+R is designed for semiconductor dicing processes. This product consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eExcellent deformation behaviour, even with thicker base film\u003c\/li\u003e\n\u003cli\u003eExcellent adhesion level\u003c\/li\u003e\n\u003cli\u003eEasy unwind\u003c\/li\u003e\n\u003cli\u003eRecyclable\u003c\/li\u003e\n\u003cli\u003eClean room product\u003c\/li\u003e\n\u003cli\u003eREACH compliant\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eStructure\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePressure sensitive acrylic-based adhesive\u003c\/li\u003e\n\u003cli\u003eClear transparent PVC film (better visual inspection)\u003c\/li\u003e\n\u003cli\u003eSilicone release coating\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch3\u003eProperties\u003c\/h3\u003e\n\u003ctable cellspacing=\"1\" cellpadding=\"1\" border=\"1\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFilm type\u003c\/td\u003e\n\u003ctd\u003ePlasticized PVC Film\u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAdhesive type\u003c\/td\u003e\n\u003ctd\u003eAcrylic-based\u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTotal thickness\u003c\/td\u003e\n\u003ctd\u003e0.130 mm\u003c\/td\u003e\n\u003ctd\u003eEN 1942\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCarrier thickness\u003c\/td\u003e\n\u003ctd\u003e0.120 mm\u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAdhesive thickness\u003c\/td\u003e\n\u003ctd\u003e0.010 mm\u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAdhesion to Si-wafer\u003c\/td\u003e\n\u003ctd\u003e120 cN\/20 mm\u003c\/td\u003e\n\u003ctd\u003eJIS Z 0237*\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eUnwind force\u003c\/td\u003e\n\u003ctd\u003e60 cN\/20 mm\u003c\/td\u003e\n\u003ctd\u003eEN 1944\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTensile strength MD\u003c\/td\u003e\n\u003ctd\u003e90 N\/20 mm\u003c\/td\u003e\n\u003ctd\u003eEN 14410\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElongation MD\u003c\/td\u003e\n\u003ctd\u003e270 %\u003c\/td\u003e\n\u003ctd\u003eEN 14410\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIonic Impurities\u003c\/td\u003e\n\u003ctd\u003e\u0026lt; 3 ppm\u003c\/td\u003e\n\u003ctd\u003eIon Chromatography Analysis**\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eColour\u003c\/td\u003e\n\u003ctd\u003eTransparent\u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd rowspan=\"2\"\u003eTransport and storage conditions\u003c\/td\u003e\n\u003ctd rowspan=\"1\"\u003eTemperature 15 to 30°C \u003c\/td\u003e\n\u003ctd\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd rowspan=\"1\"\u003eRelative humidity 40 to 75% RH\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003e*Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.\u003cbr\u003e**(Na+, K+, Cl-, NO2-, NO3-, PO43-, SO42-).\u003c\/p\u003e\n\u003cp\u003eCAUTION: The above are typical values and should not be used in writing specifications.\u003cbr\u003eDetails from the test methods are described on the customer product specification.\u003c\/p\u003e\n\u003ch3\u003eApplication\u003c\/h3\u003e\n\u003cp\u003e\u003cspan\u003eNitto Semiconductor Wafer Tape SWT 10T+R is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).\u003c\/span\u003e\u003c\/p\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":48707357573409,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_NBE_SWT_L.jpg?v=1713107436","url":"https:\/\/www.hongteckhin.com.sg\/zh\/products\/semiconductor-wafer-processing-tape-swt-10t-r","provider":"Hong Teck Hin","version":"1.0","type":"link"}