{"product_id":"solvent-resistance-dicing-tape","title":"Solvent Resistance Dicing Tape","description":"\u003cp\u003eDicing tape with solvent resistance is for special processes like TSV wafers.\u003cbr\u003e\u003cbr data-mce-fragment=\"1\"\u003eTAIKO™ process and temporary carrier technology has been developed for very thin wafer processes in TSV (Trough-Silicon Via) wafers and IGBT. In these areas, solvent cleaning is necessary, but such very thin wafers cannot be handled without any support tapes. The solvent resistance dicing tape can support very thin wafers during the solvent cleaning process and it can be diced afterword.\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eExcellent solvent resistance with excellent dicing performance.\u003c\/li\u003e\n\u003cli\u003eGood pick up performance after solvent cleaning process.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eStructure\u003c\/h3\u003e\n\u003cp\u003e\u003cimg alt=\"\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_006_img_structure_txt.jpg?v=1713106486\"\u003e\u003c\/p\u003e\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cdiv class=\"g-mb20 m-richtext\"\u003e\n\u003cul\u003e\n\u003cli\u003eSolvent wafer cleaning process on dicing tape after removing temporary carrier for TSV wafer and ultra thin wafer.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg alt=\"\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_006_img_application_txt.png?v=1713106525\"\u003e\u003c\/p\u003e\n\u003c\/div\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":48707300589857,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_006_img_elep_onpalephoto_L.jpg?v=1713106549","url":"https:\/\/www.hongteckhin.com.sg\/vi\/products\/solvent-resistance-dicing-tape","provider":"Hong Teck Hin","version":"1.0","type":"link"}