{"product_id":"protection-tape-remover-from-taiko™-wafer-nel-system™-series","title":"Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series","description":"\u003cp\u003eThis equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .\u003c\/p\u003e\n\u003ch3\u003eHR9000\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eFull-auto Tape Remover for 200mmTAIKO wafer\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eOperation flow\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_008_flow_HR9000_txt.png?v=1713091841\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_008_flow_HR9000_txt.png?v=1713091841\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_008_img_HR9000photoS.jpg?v=1713091851\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_008_img_HR9000photoS.jpg?v=1713091851\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003e\u003cstrong\u003eFeatures\u003c\/strong\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eTAIKO wafer available\u003c\/li\u003e\n\u003cli\u003eNon-contact transferring by Bernoulli method\u003c\/li\u003e\n\u003cli\u003eContamination-less transferring (by using Twin arm Robot)\u003c\/li\u003e\n\u003cli\u003eStable peeling performance by Peeling bar, Peeling trigger, Edge keeper\u003cbr\u003e(Peeling trigger \u0026amp; Edge keeper: Option)\u003c\/li\u003e\n\u003cli\u003eLow stress peeling by partly peeling tape applying\u003c\/li\u003e\n\u003cli\u003eEasy operation by Touch panel \u0026amp; Recipe function\u003c\/li\u003e\n\u003cli\u003eFollow to CE mark \/ SEMI S2\/S8\u003c\/li\u003e\n\u003cli\u003eAdding SECS\/GEM available\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eBasic spesifications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eApplicable wafer size：　8 inch／6 inch\u003c\/li\u003e\n\u003cli\u003eApplicable wafer thickness：　TAIKOwafer：50um or more,\u003cbr\u003eNormal wafer: 150um or more\u003c\/li\u003e\n\u003cli\u003eThroughput：　TAIKOwafer：30wafers\/hr.\u003cbr\u003eNormal wafer： 50wafers\/hr\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e*Above spec. values will be influenced by wafer\/tape\/other conditions, and in several cases, the option function is included.\u003cbr\u003eIn the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.\u003c\/p\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":48706017493281,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/protection-tape-remover-from-taiko%e2%84%a2-wafer-nel-system%e2%84%a2-series","provider":"Hong Teck Hin","version":"1.0","type":"link"}