{"product_id":"protection-tape-remover-for-backgrinding-process-nel-system™-series","title":"Protection Tape Remover for Backgrinding Process NEL SYSTEM™ Series","description":"\u003cp\u003eThis equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type \u0026amp; Semi-auto type machines are lined up, and large size wafers are also available.\u003c\/p\u003e\n\u003ch3\u003eHR3000III\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eFull-auto Tape Remover for 300mm wafer\u003c\/strong\u003e\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eOperation flow\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HR3000III_txt.png?v=1713094657\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HR3000III_txt.png?v=1713094657\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HR3000photo_S.jpg?v=1713094669\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HR3000photo_S.jpg?v=1713094669\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eFOUP\/Open cassette available\u003c\/li\u003e\n\u003cli\u003eStable peeling performance by Peeling Trigger\u003c\/li\u003e\n\u003cli\u003eLow stress peeling by accurate control of Peeling bar\u003c\/li\u003e\n\u003cli\u003eEasy operation by Touch panel \u0026amp; Recipe function\u003c\/li\u003e\n\u003cli\u003eLog file function standard equipment\u003c\/li\u003e\n\u003cli\u003eFollow to CE mark \/ SEMI S2\/S8\u003c\/li\u003e\n\u003cli\u003eAdding Wafer mapping scanner available\u003c\/li\u003e\n\u003cli\u003eAdding SECS\/GEM available\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eBasic spesifications\u003cbr\u003e\n\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eApplicable wafer size：　300mm／200mm\u003c\/li\u003e\n\u003cli\u003eApplicable wafer thickness：　100um or more\u003c\/li\u003e\n\u003cli\u003eThroughput：　60wafers\/hr.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e*Above spec. values will be influenced by wafer\/tape\/other conditions, and in several cases, the option function is included.\u003cbr\u003eIn the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.\u003c\/p\u003e\n\u003ch3\u003eHR8500III\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eFull-auto Tape Remover for 200mm wafer\u003c\/strong\u003e\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eOperation flow\u003c\/strong\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HR8500III_txt.png?v=1713094733\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HR8500III_txt.png?v=1713094733\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HR8500photo_S.jpg?v=1713094744\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HR8500photo_S.jpg?v=1713094744\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e8\"\"\/6\"\"\/5\"\" wafer available\u003cbr\u003e4\"\" wafer handling (Option)\u003c\/li\u003e\n\u003cli\u003eTable heating function\u003c\/li\u003e\n\u003cli\u003eThin wafer available (TW version)\u003c\/li\u003e\n\u003cli\u003eEasy operation by Touch panel\u003c\/li\u003e\n\u003cli\u003eFollow to CE mark\u003c\/li\u003e\n\u003cli\u003eAdding SECS\/GEM available\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eBasic spesifications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eApplicable wafer size：　8\/6\/5\/4 inch\u003c\/li\u003e\n\u003cli\u003eApplicable wafer thickness：　250um or more、　TW version：150um or more\u003c\/li\u003e\n\u003cli\u003eThroughput：　85wafers\/hr.　（TW version：68wafers／hr.）\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e*Above spec. values will be influenced by wafer\/tape\/other conditions, and in several cases, the option function is included.\u003cbr\u003eIn the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.\u003c\/p\u003e\n\u003ch3\u003eHSA840II\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eSemi-auto Tape Remover for 200mm wafer\u003c\/strong\u003e\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eOperation flow\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HSA840_txt.png?v=1713094803\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_HSA840_txt.png?v=1713094803\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HSA8402photo_S.jpg?v=1713094814\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_HSA8402photo_S.jpg?v=1713094814\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e8\"\"\/6\"\"\/5\"\"\/4\"\" wafer available\u003c\/li\u003e\n\u003cli\u003e8\"\"- 4\"\" wafer handling available by 1 table\u003c\/li\u003e\n\u003cli\u003eEasy operation by Touch panel\u003c\/li\u003e\n\u003cli\u003eFollow to CE mark \/ SEMI S2\/S8\"\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eBasic spesifications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eApplicable wafer size：　8\/6\/5\/4 inch\u003c\/li\u003e\n\u003cli\u003eApplicable wafer thickness：　250um or more\u003c\/li\u003e\n\u003cli\u003eThroughput：　App.50sec.／wafer\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e*Above spec. values will be influenced by wafer\/tape\/other conditions, and in several cases, the option function is included.\u003cbr\u003eIn the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.\u003c\/p\u003e\n\u003ch3\u003eRHSA840II\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eSemi-auto Tape Remover for 200mm wafer\u003c\/strong\u003e\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eOperation flow\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_RHSA840II_txt.jpg?v=1713094883\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_flow_RHSA840II_txt.jpg?v=1713094883\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_RHSA840IIphoto_S.jpg?v=1713094895\" alt=\"\" data-mce-src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/backgrinding_006_img_RHSA840IIphoto_S.jpg?v=1713094895\"\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003ePeeling the protection tape from Wafer-mount-frame\u003c\/li\u003e\n\u003cli\u003e8\"\/6\"\/5\"\/4\" wafer available\u003c\/li\u003e\n\u003cli\u003e8\" frame available（6\" frame: Option）\u003c\/li\u003e\n\u003cli\u003e8\"- 4\" wafer handling available by 1 table\u003c\/li\u003e\n\u003cli\u003ePeeling protection tape from stand-alone wafer (Option)\u003c\/li\u003e\n\u003cli\u003eEasy operation by Touch panel\u003c\/li\u003e\n\u003cli\u003eFollow to CE mark \u0026amp; SEMI S2\/S8\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eBasic spesifications\u003cbr\u003e\n\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eApplicable frame size：　8 inch, (6 inch: Option)\u003c\/li\u003e\n\u003cli\u003eApplicable wafer size：　8\/6\/5\/4 inch\u003c\/li\u003e\n\u003cli\u003eApplicable wafer thickness：　100um or more、　250um or more（for stand-alone wafer)\u003c\/li\u003e\n\u003cli\u003eThroughput：　50sec.／wafer\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e*Above spec. values will be influenced by wafer\/tape\/other conditions, and in several cases, the option function is included.\u003cbr\u003eIn the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.\u003c\/p\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":48706284880161,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/protection-tape-remover-for-backgrinding-process-nel-system%e2%84%a2-series","provider":"Hong Teck Hin","version":"1.0","type":"link"}