{"product_id":"loctite®-eccobond-uf-3810","title":"LOCTITE® ECCOBOND UF 3810","description":"\u003cdiv class=\"product__features\"\u003eLOCTITE ECCOBOND UF 3810, Epoxy, Underfill\u003c\/div\u003e\n\u003cdiv class=\"product__descriptionText\" data-original-html=\"LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.\"\u003eLOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.\u003c\/div\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":50390546481441,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/packshot-grp-loctite-eccobond-uf-3810-102997-05-2019.webp?v=1727836234","url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/loctite%c2%ae-eccobond-uf-3810","provider":"Hong Teck Hin","version":"1.0","type":"link"}