{"product_id":"loctite®-eccobond-ncp-5209","title":"LOCTITE® ECCOBOND NCP 5209","description":"\u003cdiv class=\"product__features\"\u003eA yellow non-conductive die-attach adhesive for thermal compression bonding processes in flip-chip to laminate assembly.\u003c\/div\u003e\n\u003cdiv class=\"product__descriptionText\" data-original-html=\"LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.\"\u003eLOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip-chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. It cures fast when exposed to heat.\u003c\/div\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":50390492971297,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/packshot-grp-loctite-eccobond-ncp-5209-07-2020.webp?v=1727835395","url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/loctite%c2%ae-eccobond-ncp-5209","provider":"Hong Teck Hin","version":"1.0","type":"link"}