{"product_id":"loctite®-eccobond-e-3230","title":"LOCTITE® ECCOBOND E 3230","description":"\u003cdiv class=\"product__features\"\u003eLOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant\u003c\/div\u003e\n\u003cdiv class=\"product__descriptionText\" data-original-html=\"LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.\"\u003eLOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.\u003c\/div\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":50390494478625,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/packshot-indv-loctite-eccobond-e-3230-82206-07-2019.webp?v=1727835446","url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/loctite%c2%ae-eccobond-e-3230","provider":"Hong Teck Hin","version":"1.0","type":"link"}