{"product_id":"die-attach-film-with-pressure-sensitive-dicing-tape-elep-mount™-em-series","title":"Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT™ (EM Series)","description":"\u003cp\u003eAchieves high reliability by combining dicing and die attachment functions.\u003c\/p\u003e\n\u003cp\u003e\u003cspan\u003eThis adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.\u003c\/span\u003e\u003c\/p\u003e\n\u003ch3\u003e\u003cspan\u003eFeatures\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eOutstanding pick-up performance with a 50µm thick chip.\u003c\/li\u003e\n\u003cli\u003eEnables wafer mounting at 40°C.\u003c\/li\u003e\n\u003cli\u003eIntegrated with pressure-sensitive dicing tape.\u003c\/li\u003e\n\u003cli\u003eEnables label shaping.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eStructure\u003c\/h3\u003e\n\u003cp\u003e\u003cimg alt=\"\" src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_002_img_structure_txt.png?v=1713075269\"\u003e\u003c\/p\u003e","brand":"Hong Teck Hin","offers":[{"title":"Default Title","offer_id":48700898738465,"sku":"","price":0.0,"currency_code":"SGD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0763\/0730\/0641\/files\/dicing_002_img_EMphoto_L.jpg?v=1713075331","url":"https:\/\/www.hongteckhin.com.sg\/my\/products\/die-attach-film-with-pressure-sensitive-dicing-tape-elep-mount%e2%84%a2-em-series","provider":"Hong Teck Hin","version":"1.0","type":"link"}